Product
PCB MAKING SERVICE
One Stop Electronic Manufacturing Services
PCB TECHNICAL CAPACITY
Layers: Mass production: 2-58 layers / Pilot run: 64 layersLayers: Mass production: 2-58 layers / Pilot run: 64 layers
Max. Thickness: Mass production: 394mil (10mm)/ Pilot run: 17.5mm
Material: FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min. width/Spacing: Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mi(10Z)
Min.Copper Thickness: UL certificated:6.0 0Z/Pilot run:120Z
Min. Hole Size: Mechanical drill:8mil (0.2mm)Laser drill:3mil (0.075mm)
Min.Panel Size: 1150mm x 560mm
Aspect Ratio: 18:1
Surface Finish: HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process: Buried Hole, Blind Hole. Embedded Resistance. Embedded Capacity, Hybrid, Partial hybrid. Partial high density, Back drilling, and Resistance control.